Techniques for joining one or more structures of an electronic device

ABSTRACT

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority under 35 U.S.C § 119(e)to U.S. Provisional Application No. 62/164,399, filed on May 20, 2015,and titled “TECHNIQUES FOR JOINING ONE OR MORE STRUCTURES OF ANELECTRONIC DEVICE,” the disclosure of each is incorporated herein byreference in its entirety.

FIELD

The described embodiments relate generally to electronic deviceenclosures. In particular, the present embodiments relate to variousbonding and joining techniques between multiple features to electronicdevice enclosures.

BACKGROUND

An enclosure of an electronic device is generally associated aprotective cover for several internal components of the electronicdevice. There is a general trend to decrease the overall form factor ofelectronic devices and in turn the enclosure. For example, an enclosureof a laptop computing device may be formed from aluminum having areduced thickness. A decrease in enclosure thickness may correspond toan enclosure with reduced strength and rigidity.

One method for increasing the strength and rigidity of the enclosurerequires adhesively securing a rigid structure to an interior region ofthe enclosure. However, the bond strength between rigid structure andthe enclosure is typically insufficient and the rigid structure maybecome detached from the enclosure. Further, when the rigid structureand the enclosure are formed from a metal, the adhesive includes athermal conductively substantially less than that of the rigid structureand the enclosure. Accordingly, the adhesive may act as a thermalbarrier between the rigid structure and the enclosure, causing heatgenerated from internal components may to remain in the electronicdevice rather than dissipate from the electronic device. This may leadto damage to the internal components, and in turn, the electronicdevice.

SUMMARY

In one aspect, a method for forming an electronic device having anenclosure that includes a first part and a second part rotatably coupledwith the first part is described. The second part may include a magnet.The method may include engaging an attachment feature with a bondingtool configured to bond the attachment feature with the first part. Themethod may further include actuating the attachment feature via thebonding too that causes a solder material disposed between theattachment feature and the first part to melt and bond the attachmentfeature with the first part.

In another aspect, a method for solid-state bonding a first part with asecond part at a joint region is described. The first part may be formedof a first type material and the second part formed from a second typematerial dissimilar to the first type material. The method may includeapplying a force by a bonding tool to the first part when the first partis in contact with the second part at the joint region. The method mayfurther include actuating, by the bonding tool, the first part in arepeated manner with respect to the second part in a first direction andsubsequently in a second direction opposite the first direction suchthat at least some of the first type material intermingles with at leastsome of the second type material within the joint region while applyingthe force.

In another aspect, an electronic device is described. The electronicdevice may include a base portion that includes a magnet. The method mayfurther include a housing rotatably coupled with the base portion andformed from a first type metal. The housing may include an attachmentfeature formed from a second type metal different from the first typemetal. In some embodiments, in a closed configuration between the baseportion and the housing, the second type metal causes the attachmentfeature to magnetically couple with the magnet to define a magneticcircuit, and the housing is separated from the base portion by a gapthat is based upon the magnetic circuit.

Other systems, methods, features and advantages of the embodiments willbe, or will become, apparent to one of ordinary skill in the art uponexamination of the following figures and detailed description. It isintended that all such additional systems, methods, features andadvantages be included within this description and this summary, bewithin the scope of the embodiments, and be protected by the followingclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 illustrates an isometric view of an embodiment of an electronicdevice in an open configuration;

FIG. 2 illustrates an isometric view of the electronic device shown inFIG. 1, showing the electronic device in a closed configuration;

FIG. 3 illustrates a partial side view of the electronic device in theclosed configuration, showing an enlarged view of Section A in (FIG. 2),with the display housing separated from the base portion by a gapdefined as a space or void between the display housing 102 and the baseportion;

FIG. 4 illustrates a plan view of an enclosure having several attachmentfeatures disposed in the enclosure;

FIG. 5 illustrates a side view of the first attachment featureundergoing a bonding operation to secure the first attachment featurewith the enclosure;

FIG. 6 illustrates a side view of the first attachment feature bondedwith the enclosure using the bonding tool shown in FIG. 4;

FIG. 7 illustrates a side view of the enclosure and the first attachmentfeature shown in FIG. 6 after undergoing a material removal operation;

FIG. 8 illustrates a side view of the enclosure and the first attachmentfeature shown in FIG. 7 with an additional attachment feature securedwith the enclosure and the first attachment feature;

FIG. 9 illustrates a side view of an alternate embodiment of anenclosure having a first attachment feature and a filler materialdisposed in a space between the first attachment feature, the soldermaterial, and the enclosure;

FIG. 10 illustrates an isometric view of an embodiment of a portion ofan enclosure that includes several protruding features secured with aninterior region of the enclosure;

FIG. 11 illustrates a side view of the first protruding feature engagedwith a bonding tool to secure the first protruding feature with theenclosure;

FIG. 12 illustrates a side view of the first protruding feature shown inFIG. 11 with the first protruding feature bonding with the enclosure;

FIG. 13 illustrates an isometric view of an exterior region of theenclosure shown in FIG. 10;

FIG. 14 illustrates a bottom view of an electronic device having severalprotruding features disposed between a top case and a bottom case of theelectronic device;

FIG. 15 illustrates a side view a protruding feature bonded with anenclosure, with the protruding feature undergoing a material removaloperation;

FIG. 16 illustrates a side view of the protruding feature after thematerial removal process with an internal cavity;

FIG. 17 illustrates an isometric view of a portion of an enclosureincluding a beam feature secured with an interior region of theenclosure;

FIG. 18 illustrates an isometric view of an enclosure secured in afixture and undergoing a bonding operation, in accordance with thedescribed embodiments;

FIG. 19 illustrates a side view of the beam feature undergoing thebonding operation to secure the beam feature with the enclosure;

FIG. 20 illustrates a side view of the beam feature shown in FIG. 19with the beam feature bonding with the enclosure;

FIG. 21 illustrates an isometric view of an exterior region of theenclosure shown in FIG. 21;

FIG. 22 illustrates an isometric view of multiple beam features securedwith an enclosure using a bonding process;

FIG. 23 illustrates an isometric view of an alternate embodiment of abonding tool;

FIG. 24 illustrates a side view of an embodiment of an attachmentfeature undergoing a bonding operation to secure the attachment featurewith an enclosure, in accordance with the described embodiments;

FIG. 25 illustrates the attachment feature shown in FIG. 24 after thebonding process;

FIG. 26 illustrates an isometric view of a portion of an enclosurehaving a protruding feature and an intermediate feature secured with aninterior region of the enclosure using a bonding process, in accordancewith the described embodiments;

FIG. 27 illustrates a side view of the protruding feature and theintermediate feature shown in FIG. 26 undergoing a bonding operation tosecure the protruding feature and the intermediate feature with theenclosure;

FIG. 28 illustrates a side view of the protruding feature and theintermediate feature shown in FIG. 27 further undergoing the bondingoperation;

FIG. 29 illustrates a side view of the protruding feature and theintermediate feature secured with the enclosure;

FIG. 30 illustrates an isometric view of several beam features securedwith a portion of an enclosure using a bonding process, in accordancewith the described embodiments;

FIG. 31 illustrates a side view of a first beam feature and a secondbeam feature undergoing a bonding operation to secure the first beamfeature and the second beam feature with an enclosure;

FIG. 32 illustrates a side view of the first beam feature and the secondbeam feature shown in FIG. 31, further undergoing the bonding process;

FIG. 33 illustrates a side view of the first beam feature and the secondbeam feature shown in FIG. 32, further undergoing the bonding process;

FIG. 34 illustrates several beam features secured with an enclosure foran electronic device, in accordance with the described embodiments;

FIG. 35 illustrates an isometric view of an embodiment of a beam featureincluding several rib features extending along a region the beamfeature;

FIG. 36 illustrates an isometric view of an alternate embodiment of abeam feature including several rib features extending along a region ofthe beam feature;

FIG. 37 illustrates an isometric view of the beam feature shown in FIG.35 undergoing a bonding operation to secure the beam feature with anenclosure;

FIG. 38 illustrates an isometric view of the beam feature shown in FIG.37, subsequent to the beam feature being with the enclosure by thebonding operation;

FIG. 39 illustrates a plan view of the beam feature shown in FIG. 36undergoing a bonding operation to secure the beam feature with anenclosure;

FIG. 40 illustrates a plan view of the beam feature shown in FIG. 39with the beam feature secured with the enclosure;

FIG. 41 illustrates an isometric view of an embodiment of a protrudingfeature undergoing a bonding operation by bonding tool to bond theprotruding feature with an enclosure, in accordance with the describedembodiments;

FIG. 42 illustrates a side view of the bonding tool rotating theprotruding feature to form a bond between the protruding feature and theenclosure;

FIG. 43 illustrates a side view showing the protruding feature partiallyembedded in the enclosure due to the bonding operation;

FIG. 44 illustrates a side view of the protruding feature bonded withthe enclosure;

FIG. 45 illustrates a flowchart showing a method for forming anelectronic device, in accordance with the described embodiments; and

FIG. 46 illustrates a flowchart showing a method for forming anelectronic device having an enclosure that includes a first part and asecond part rotatably coupled with the first part, in accordance withthe described embodiments.

Those skilled in the art will appreciate and understand that, accordingto common practice, various features of the drawings discussed below arenot necessarily drawn to scale, and that dimensions of various featuresand elements of the drawings may be expanded or reduced to more clearlyillustrate the embodiments of the present invention described herein.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

In the following detailed description, references are made to theaccompanying drawings, which form a part of the description and in whichare shown, by way of illustration, specific embodiments in accordancewith the described embodiments. Although these embodiments are describedin sufficient detail to enable one skilled in the art to practice thedescribed embodiments, it is understood that these examples are notlimiting such that other embodiments may be used, and changes may bemade without departing from the spirit and scope of the describedembodiments.

The following disclosure relates to various techniques for metallurgicbonding or joining two or more structural features to form part of anenclosure, or housing, of an electronic device. The described techniquesinclude variations in soldering and welding. The soldering and weldingtechniques may include, but are not limited to, ultrasonic soldering,ultrasonic welding (linear and torsional), ultrasonic bonding, andlinear friction welding. A substrate defining a portion of the enclosuremay include one or more structural features joined by soldering orwelding with an interior region of the enclosure. The “interior region”may be defined as a region not visible to a user of the electronicdevice when the electronic device is fully assembled. In some cases, thesubstrate includes a thickness of approximately 1 millimeter (“mm”) orless. Traditional soldering and welding techniques use relatively highpower tools resulting in visible marks, traces, and/or burns that extendthrough the thickness of the substrate and are visible on an exteriorregion (opposite the interior region) of the substrate. The “exteriorregion” may be defined as a cosmetic region that is visible to the userwhen the electronic device is fully assembled. However, the bondingoperations described herein are optimized such that visible marks,traces, and/or burns associated with the bonding operations are notformed on the exterior region. This allows for an enclosure of anelectronic device with structural enhancements on the interior regionwith no visible marks, traces, and/or burns on the exterior region.

Various embodiments of a structural feature or features joined to theenclosure may be used. For example, an attachment feature, or attachmentplate, may be bonded to an enclosure by ultrasonic soldering. Theenclosure may be formed from a first material or a first type metal,such as aluminum or an aluminum alloy. An ultrasonic soldering tool maybe used to generate ultrasonic waves through the attachment feature tosoften a solder material disposed between the attachment feature and theenclosure, causing the solder material to reflow and bond together thestructural features. The attachment feature may be formed from amagnetically attractable material (such as a ferrous material).Alternatively, the attachment feature may be a magnet. In this manner,in a closed configuration of the electronic device, the attachmentfeature may be magnetically attracted to another feature located in abase portion of the electronic device, such as a magnet. However, theattachment feature may be formed from a second material or a second typemetal, such as titanium, molybdenum, stainless steel, brass, bronze, orthe like. Accordingly, the second type material may be different fromthe first type material. Also, the second type material may include ahardness, strength, and/or durability greater than that of the firsttype material. As a result, the first type material (or first typemetal) may include a first hardness and the second type material (orsecond type metal) may include a second hardness greater than the firsthardness, based upon the material makeup differences between the firsttype material and the second type material. This allows the enclosure toinclude a reduced thickness, while the attachment feature (or features)provides a material of a higher strength than that of aluminum toincrease the overall rigidity of the enclosure.

Other structural features may be secured with the enclosure bymetallurgic bonding. Further, the bonding techniques described hereinmay include solid-state bonding techniques. A “solid-state bondingtechnique” may be defines as a bonding operation that does not require abonding agent, such as a solder material. In other words, a solid-statebonding technique may directly bond together, for example, two or moremetal parts. The solid-state bonding techniques described herein mayinclude actuating, or rubbing, a first part against a second part inorder to secured the first part with the second part. For example, acomponent, such as a protruding feature (or protruding features) or abeam feature (or beam features), may be secured with the enclosure bymeans such as linear ultrasonic welding or torsional ultrasonic welding.Linear ultrasonic welding may include an ultrasonic welding tool thatsecures the component, engages the component with the enclosure, anddrives the component back and forth in a linear direction at apredetermined frequency (or within a frequency range) against theenclosure. Rather than driving the component in a linear direction,torsional ultrasonic welding may include driving the component back andforth along a generally arc-like, or partially circular, path. Thelinear and torsional ultrasonic bonding techniques include frictionalforces which break down metal oxides (of the component and theenclosure) in a joint region defined by a location where the componentengages the enclosure, causing a diffusion bond between atoms of thecomponent and the enclosure to diffuse into one another.

In some cases, the protruding feature may be a boss having an internalthreaded region designed to receive a threaded fastener. This allows theenclosure that includes one or more bosses to couple with anotherenclosure feature or internal component by way of a threaded engagementbetween the threaded fastener (securing the enclosure feature) inthreaded engagement with the internal threaded region. Also, the beamfeature may be secured by similar welding techniques. The beam featuremay include a rectangular I-shaped bar or a T-shaped bar. The beamfeature may provide not only additional structural rigidity but also athermal pathway designed to dissipate heat from a component thermallycoupled with the beam feature. The protruding feature and the beamfeature may be formed from the second type material previouslydescribed. Accordingly, the metallurgic bonding techniques allow for analuminum enclosure to include a dissimilar metal bonded with thealuminum enclosure. Further, these techniques use a relatively lowamount of heat as compared to traditional welding applications. Thisallows for an enclosure to include one or more structural featureswelded to an interior region of the enclosure without any visible marks,traces, and/or burns (associated with the described welding techniques)visible on an exterior region of the enclosure.

Also, the welding techniques include an added advantage of controlledplacement of the attachment feature. For example, the back and forthmotion previously described may displace the attachment featureapproximately 10 micrometers, or microns, from an initial startingposition prior to the welding process. In this manner, the attachmentfeature is bonded to the enclosure in a desired location despitecontinuous displacement of the attachment feature during the weldingoperation.

Other solid-state bonding techniques may be used to secure multiplestructural features to an enclosure. For example, a protruding featureand an intermediate feature may be co-bonded with an enclosure by anultrasonic bonding technique, with the intermediate feature disposedbetween the protruding feature and the enclosure. The protruding featureand the enclosure may be formed from an aluminum alloy, while theintermediate feature may include a substantially pure aluminumcomposition, and accordingly, is relatively soft as compared to theprotruding feature and the enclosure. The ultrasonic bonding may causethe intermediate feature to deform or soften, and bond with theprotruding feature and the enclosure, while also serving a bondingfeature to bond the protruding feature with the enclosure.

Still, additional techniques may be used to bond together two or morestructural features. For example, a beam feature may be joined with anenclosure by linear friction welding. Linear friction welding mayinclude a welding tool that provides a relatively large clamping force(to the beam feature) and displacement, as compared to the clampingforce and displacement, respectively, of the linear and torsionalultrasonic welding processes. The beam feature may be formed from thesecond type metal previously described. According, the beam feature mayinclude a different material makeup as compared to, for example, anenclosure. Also, the welding tool engages the beam feature and applies arelatively high force to the enclosure via the beam feature. Thisengaging force coupled with the relatively large displacement of thebeam feature during the welding operation produces a relatively highamount of heat, causing a portion of both the beam feature and theenclosure to soften and swirl together. In some cases, the beam featureincludes a strength and rigidity greater than that of the enclosure. Inthose cases, as a result of the linear friction welding process, thestrength and rigidity of the enclosure significantly increases, due inpart to the beam feature, despite a reduced thickness of the enclosure.

Also, an additional solid-state bonding technique may include arotational friction welding tool may be used to combine a protrudingfeature with an enclosure. The protruding feature may include acylindrical shape formed from a metal or metal alloy. The tool includesa weld head receives the protruding feature and rotates the protrudingfeature at relatively high revolutions per minute (“RPM”) while engagingthe protruding feature with the enclosure. Further, the protrudingfeature may be rotated at an RPM sufficient to create enough frictionalheat in the enclosure, causing the enclosure to soften and allowingprotruding feature to be driven and embedded into the enclosure.Traditional rotational friction welding applications involve weldinglarge structures having a diameter much larger than that of theprotruding feature. Further, in those applications, visible marks,traces, and/or burns associated with an opposing region are notaccounted for as little or no consideration is given with respect toaesthetic features. However, in the embodiments described herein, therotational friction welding tool is capable of generating sufficientheat to embed the protruding feature into the enclosure, even when theprotruding feature includes a diameter of 2 mm. Further, the operationdoes not produce any visible marks, traces, and/or burns on an exterioror cosmetic region of the enclosure.

These and other embodiments are discussed below with reference to FIGS.1-45. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 illustrates an isometric view of an embodiment of an electronicdevice 100 in an open configuration. An “open configuration” refers to adisplay housing 102 positioned away from the base portion 104, similarto the depiction in FIG. 1. In some embodiments, the electronic device100 is a tablet computing device. In other embodiments, the electronicdevice 100 is a desktop computing device. In the embodiment shown inFIG. 1, the electronic device 100 is a laptop computing device. Asshown, the display housing 102 may be coupled with the base portion 104in a manner such that the display housing 102 may be rotated withrespect to the base portion 104, or vice versa. The display housing 102and the base portion 104 may define an enclosure of the electronicdevice 100. Also, in some embodiments, the display housing 102 and thebase portion 104 are made from a first material or first type metal,such as aluminum or an aluminum alloy. The display housing 102 mayinclude a display panel 106 designed to display visual content viewableby a user. Accordingly, the display panel 106 may be an operationalcomponent of the electronic device 100, in that the display panel 106performs an operation based upon an electrical communication. The baseportion 104 may include a keyboard assembly 108 and a touch pad 110,both of which are designed to input a gesture to one or more processors(not shown) that may be disposed within the base portion 104. Also, thebase portion 104 may include a top case 112 coupled with a bottom case(not shown) to enclosure several electronic components used by theelectronic device 100.

FIG. 2 illustrates an isometric view of the electronic device 100 shownin FIG. 1, showing the electronic device 100 in a closed configuration.The “closed configuration” refers to the display housing 102 proximateto the base portion 104 in the manner shown. The electronic device 100may include several features designed in part to create a specifieddistance or gap between the display housing 102 and the base portion104. For example, the display housing 102 may include a first attachmentfeature 132 and a second attachment feature 134. In some embodiments,the first attachment feature 132 and the second attachment feature 134are formed from a magnetically attractable material, such as steel(including stainless steel) or iron. However, the first attachmentfeature 132 and the second attachment feature 134 may be formed fromother magnetically attractable materials. Also, the base portion 104 mayinclude a first magnet 142 and a second magnet 144 in locationscorresponding to the first attachment feature 132 and the secondattachment feature 134, respectively, such the display housing 102 maymagnetically couple with the base portion 104 in the closedconfiguration by way of the attachment features and the magnets.Generally, the first magnet 142 and the second magnet 144 include a sizeand a shape corresponding to that of the first attachment feature 132and the second attachment feature 134, respectively. The arrangement ofthe structural features may be reversed. For example, in someembodiments, the base portion 104 includes first attachment feature 132and the display housing 102 includes the first magnet 142. The securingof the structural features to the features of the electronic device 100will be shown and discussed below.

FIG. 3 illustrates a partial side view of the electronic device 100 inthe closed configuration, showing an enlarged view of Section A in (FIG.2), with the display housing 102 separated from the base portion by agap 152 defined as a space or void between the display housing 102 andthe base portion 104. Generally, the gap 152 is consistent throughoutall regions between the display housing 102 and the base portion 104,and in particular, between the display housing 102 and the top case 112.In this regard, FIG. 3 shows the first attachment feature 132magnetically coupled with the first magnet 142, causing a relationshipbetween the display housing 102 and the base portion 104 such that thegap 152 is consistent in locations between the display housing 102 andthe base portion 104. The magnetically coupling is represented in partby the magnetic field lines in FIG. 3, denoted as dotted lines havingarrows. Also, although not shown, the second attachment feature 134 mayalso magnetically couple with the second magnet 144 (both shown in FIG.2) to further define the gap 152 as having a consistent distance betweenthe display housing 102 and the base portion 104. Also, the attachmentfeatures and the magnets, although not fully extending around thedisplay housing 102 and the base portion 104, may still include a sizeand a shape, and an associated magnetic coupling, to cause the gap 152to be of a consistent distance in all locations between the displayhousing 102 and the base portion 104 in the closed configuration,including locations that do not includes an attachment feature or amagnet.

FIG. 4 illustrates a plan view of an enclosure 202 having severalattachment features disposed in the enclosure 202. In some embodiments,the enclosure 202 is a display housing, similar to the display housing102 (shown in FIG. 2). In other embodiments, the enclosure 202 is a baseportion, similar to the base portion 104 (shown in FIG. 2). Also, insome embodiments, the enclosure 202 is formed from the first type meta,such as aluminum or an aluminum alloy. As shown, the enclosure 202includes a first attachment feature 232 and a second attachment feature234 disposed on a first corner 204 and a second corner 206,respectively, of the enclosure 202. The first attachment feature 232 andthe second attachment feature 234 may be formed from a metal, or metalalloy, designed to increase the stiffness and structural rigidity of theenclosure 202. For example, the first attachment feature 232 and thesecond attachment feature 234 may be formed from the second type metal,such as titanium, molybdenum, stainless steel, brass, bronze, or thelike. Further, the second type material may be different from the firsttype material, in that the second type material may include a hardness,strength, and/or durability greater than that of the first typematerial. Generally, any metal or metal alloy having a relatively highstiffness-to-weight ratio may be used. Accordingly, the first attachmentfeature 232 and the second attachment feature 234 may be formed from ametal other than a metal used to form the enclosure 202. This allows theenclosure 202 to include a metal having a relatively small weight (basedon the weight of aluminum) and a relatively small thickness, such as 1millimeter or less, and still maintain a similar stiffness andstructural rigidity of an enclosure having a greater thickness andaccordingly, more material, than that of the enclosure 202. However, insome embodiments, the first attachment feature 232 and the secondattachment feature 234 include aluminum.

In some cases, the first attachment feature 232 and the secondattachment feature 234 are designed to receive and couple with one ormore display mounts used to secured a display panel (such as the displaypanel 106 in FIG. 1) with the enclosure 202. Also, when the firstattachment feature 232 and the second attachment feature 234 are formedfrom a magnetically attractable material, such as stainless steel, thefirst attachment feature 232 and the second attachment feature 234 maybe designed to not only provide additional stiffness but alsomagnetically couple with one or more magnets disposed in anotherstructural enclosure of an electronic device. Also, although the firstattachment feature 232 and the second attachment feature 234 aredisposed around the first corner 204 and the second corner 206,respectively, of the enclosure 202, the first attachment feature 232 andthe second attachment feature 234 may be disposed in other locations ofthe enclosure 202. Also, in other embodiments, a single attachmentfeature may be disposed along all four corners of the enclosure 202.

In some cases, the attachment features may be adhesively secured.However, the attachment features may be bonded by other means designedto increase the functionality of the attachment features. For example,FIG. 5 illustrates a side view of the first attachment feature 232undergoing a bonding process to secure the first attachment feature 232with the enclosure 202. As shown, a bonding tool 250 may engage thefirst attachment feature 232 to perform a soldering operation. In someembodiments, the bonding tool 250 is an ultrasonic soldering tooldesigned to apply ultrasonic energy to bond the first attachment feature232 with the first attachment feature 232 using a solder material 256.As shown, the solder material 256 may be disposed in a channel of theenclosure 2020, and the first attachment feature 232 may be at leastpartially disposed in the channel of the enclosure 202. The bonding tool250 may include an ultrasonic horn 252 capable of actuating in a firstdirection and a second direction opposite the first direction (that is,back and forth) along an axis defined by a linear path (denoted by thearrow 254) delivering ultrasonic energy to the first attachment feature232 and also to a solder material 256 used to bond the first attachmentfeature 232 with the enclosure 202. Also, the bonding tool 250 may applya force (denoted by a second arrow 258) to the first attachment feature232 in a direction toward the enclosure 202. In some embodiments, theultrasonic horn 252 may be actuated with a frequency approximately inthe range of 10-40 kilohertz (“kHz”). The ultrasonic energy generatedfrom the ultrasonic horn 252 may cause a reflow, or melting, of thesolder material 256, which in turn causes the first attachment feature232 to bond with the enclosure 202. The solder material 256 may includea melting point of approximately 110 degrees Celsius. In this manner,when the enclosure 202 undergoes a chemical (for example, acidic) aspart of an anodization process, the solder material 256 does not crackor otherwise damage anodized regions of the enclosure 202 under a reflowcondition of the solder material 256. Further, the melting temperatureof the solder material 256 is such that the aluminum or aluminum alloythat forms the enclosure 202 is not disturbed, and the enclosure 202does not become deformed.

FIG. 6 illustrates a side view of the first attachment feature 232bonded with the enclosure 202 using the bonding tool 250 shown in FIG.4. The solder material 256 may include one or more metals having athermal conductivity greater than that of an adhesive. In this manner,the first attachment feature 232 may define a thermal pathway used todissipate or redirect heat away from heat-generating componentsthermally coupled with the first attachment feature 232, as heat canefficiently pass through the solder material 256 as opposed to anadhesive. Also, empirical testing has shown that the bond strength ofthe solder material 256 is significantly greater than that of anadhesive, and the first attachment feature 232 is more likely to remainsecured with the enclosure 202 when a load or force is applied to theenclosure 202 (for example, in a drop event of the enclosure 202).

Once the first attachment feature 232 is secured with the enclosure 202,in some embodiments, additional operations are applied. For example,FIG. 7 illustrates a side view of the enclosure 202 and the firstattachment feature 232 shown in FIG. 6 after undergoing a materialremoval operation. The material operation is designed such that anuppermost surface 242 of the first attachment feature 232 issubstantially co-planar, or flush, with an uppermost surface 212 of theenclosure 202. In some cases, the co-planarity between the uppermostsurfaces previously described is within 10 micrometers. Also, in someinstances, a single material removal operation to form the co-planarsurfaces also forms a uniform surface roughness across the uppermostsurface 212 of the enclosure 202 and the uppermost surface 242 of thefirst attachment feature 232. Accordingly, the surface roughness of theuppermost surface 212 may be substantially similar to that of theuppermost surface 242.

Alternatively, or in combination, additional material removal operationsmay occur to allow additional features to be coupled with the enclosure202. FIG. 8 illustrates a side view of the enclosure 202 and the firstattachment feature 232 shown in FIG. 7 with a third attachment feature236 secured with the enclosure 202 and the first attachment feature 232.In some embodiments, the third attachment feature 236 extends from thefirst attachment feature 232 to the second attachment feature 234 (shownin FIG. 3). The third attachment feature 236 may take the form of asupport structure for the enclosure 302 and/or a display disposed in theenclosure 202. Also, despite the third attachment feature 236 beingpositioned over the first attachment feature 232, the first attachmentfeature 232 may nonetheless be designed magnetically couple with, forexample, a magnet (not shown) when the first attachment feature 232 ispositioned within magnetic field lines of the magnet.

Referring again to FIG. 2, in some embodiments, the first magnet 142 andthe second magnet 144 are secured with the base portion 104 similar to amanner previously described for the first attachment feature 232 and theenclosure 202.

FIG. 9 illustrates a side view of an alternate embodiment of anenclosure 402 having a first attachment feature 432 and a fillermaterial 410 disposed in a space between the first attachment feature432, the solder material 452, and the enclosure 402. In someembodiments, the filler material 410 is a potting material that includesa relatively soft plastic material. In this manner, when an uppermostsurface 442 of the first attachment feature 432 is not co-planar, or notsub-flush, with respect to an uppermost surface 412 of the enclosure402, the filler material 410 may be designed to form a continuous,co-planar feature with respect to the uppermost surface 412. Also,although not shown, the filler material 410 may be replaced by glass,including glass beads or glass bond wires, that may be heated causingthe glass material to reflow around the first attachment feature 432.This may also assist in controlling reflow of the solder material 452.

FIG. 10 illustrates an isometric view of an embodiment of a portion ofan enclosure 502 that includes protruding features 510 secured with aninterior region 520 of the enclosure 502. The enclosure 502 may beformed from the first type metal previously described. In someembodiments, the protruding features 510 are formed from the second typemetal previously described. However, in other embodiments, theprotruding features 510 are formed from aluminum. Also, in someembodiments, the protruding features 510 are designed to receive anadditional component or other structural feature. As shown, theprotruding features 510 include a first protruding feature 512 and asecond protruding feature 514. The first protruding feature 512 mayinclude a flange region 516 (partially shown in the enlarged view)designed to provide additional stability as well as a greater surfacearea for a bonding operation. The second protruding feature 514 may bedesigned as boss that is received by a corresponding feature of anotherstructural component. Also, in order to enhance the bonding operation,the interior region 520 may include a textured region 522 in a locationbelow which the protruding features 510 are bonded with the enclosure502. For example, the enlarged view shows the textured region 522 belowthe first protruding feature 512. This will be discussed below.

In some embodiments, the first protruding feature 512 and the secondprotruding feature 514 are protrusions designed to engage an opening, oropenings, of a component. In other embodiments, the first protrudingfeature 512 and the second protruding feature 514 include an openingsuch that the first protruding feature 512 and the second protrudingfeature 514 can each receive a fastener to fasten a component with theinterior region 520. Also, although not shown, the protruding features510 may be located along various locations of the interior region 520.

FIGS. 11-16 illustrate a solid-state bonding operation used to bond theprotruding features 510 directly to an enclosure 502, as shown in FIG.10. FIG. 11 illustrates a side view of the first protruding feature 512engaged with a bonding tool 550 to secure the first protruding feature512 with the enclosure 502. The enclosure 502 may be secured in afixture 504 (partially shown) during the bonding operation. In someembodiments, the bonding tool 550 is an ultrasonic welding tool.Further, in some embodiments, the bonding tool 550 is a linearultrasonic welding tool having an ultrasonic horn 552 capable ofactuating in a first direction and a second direction opposite the firstdirection (that is, back and forth) along an axis defined by a linearpath (denoted by the arrow 554) delivering ultrasonic energy to thefirst protruding feature 512. Accordingly, the ultrasonic horn 552 maycause a back and forth motion to the first protruding feature 512. Also,the bonding tool 550 may apply a force to the first protruding feature512 (denoted by a second arrow 556) in a direction toward the enclosure502. In some embodiments, the ultrasonic horn 552 may be actuated with afrequency approximately in the range of 10-40 kilohertz (“kHz”) and maycause the first protruding feature 512 to be displaced, during thebonding operation, a distance from a centerline 558 (shown as animaginary line extending through the bonding tool 550) approximately inthe range of 7 to 15 micrometers. At these frequencies and relativelysmall distances, the first protruding feature 512 may be accuratelywelded at a desired location on the enclosure 502.

FIG. 12 illustrates a side view of the first protruding feature 512shown in FIG. 11 with the first protruding feature 512 bonding with theenclosure 502. During the bonding operation, the repeated linearactuation by the bonding tool 550 to the first protruding feature 512causes metal oxides of both the first protruding feature 512 and theenclosure 502 to break down in a joint region generally defined by abonding location between the first protruding feature 512 and theenclosure 502. This causes a diffusion bond, and atoms of the firstprotruding feature 512 and the enclosure 502 may intermingle and diffuseinto one another. Also, the textured region 522 of the enclosure 502 andthe textured region 562 of the bonding tool 550 facilitate the bondingprocess by directing the ultrasonic energy to the joint region.

FIG. 13 illustrates an isometric view of an exterior region 570 of theenclosure 502 shown in FIG. 10. For purposes of illustration, thetextured region is not shown. The exterior region 570 is generallyassociated with a cosmetic surface visible to a user when an electronicdevice (such as the electronic device 100 shown in FIG. 1) is assembled.Despite the linear ultrasonic welding operation previously described,the protruding features 510 are bonded to the interior region 520without leaving any visible marks, traces, and/or burns on the exteriorregion 570 from the ultrasonic welding operation. Also, in someembodiments, the enclosure 502 may include a thickness 572 of 3 mm orless. Further, in some embodiments, the thickness 572 is 1 millimeter orless. In either event, the exterior region 570 is free of any marks,traces, and/or burns. This allows for an electronic device that includesan enclosure 502 to include structural enhancements while stillproviding an aesthetic finish.

In additional to receiving internal components, the protruding featurescan be used in other applications. For example, FIG. 14 illustrates abottom view of an electronic device 600 having protruding features 620,such as a first protruding feature 622 and a second protruding feature624, disposed between a top case 612 and a bottom case 618 of theelectronic device 600. The electronic device 600 may similar to theelectronic device 100 (shown in FIG. 1). The protruding features 620 areshown as dotted lines positioned behind the bottom case 618. The firstprotruding feature 622 and the second protruding feature 624 may bebonded with the top case 612 by the linear ultrasonic bonding processpreviously described. Each of the protruding features 620 may bedesigned to receive a fastener extending from the bottom case 618. Inalternate embodiments, the protruding features 620 are bonded with thebottom case 618 and the fasteners extend from the top case 612. Theprotruding features 620 may provide for two structural features to besecured together without the use of external, or visible, fasteners,which leads to less openings to the environment.

In some embodiments, the protruding features previously described arebonded with an enclosure, and followed by additional processes to formadditional features. FIG. 15 illustrates a side view a protrudingfeature 674 bonded with an enclosure 652, with the protruding featureundergoing a material removal operation. A rotary tool 682 can be usedto remove material from the protruding feature 674 to define an internalcavity, which, in some embodiments, includes an internal threaded regiondesigned to receive a threaded fastener. FIG. 16 illustrates a side viewof the protruding feature 674 after the material removal process with aninternal cavity 692. In this configuration, the protruding feature 674may be referred to as a boss having an internal cavity 692.

FIG. 17 illustrates an isometric view of a portion of an enclosure 702including a beam feature 710 secured with an interior region 720 of theenclosure 702. The enclosure 702 may part of a structural feature of anelectronic device, such as a top case, a bottom case, or a displayhousing, and may be formed from the first type metal previouslydescribed. Also, the beam feature 710 may be formed from the second typemetal previously described. However, in other embodiments, the beamfeature 710 includes aluminum. The beam feature 710 may include severaluses. For example, the beam feature 710 may provide structural supportfor the enclosure 702, particularly in cases where a thickness 772 ofthe enclosure 702 is a few millimeters or less. Also, the beam feature710 may be used in conjunction with one or more beam features (notshown) to receive an internal component used in an electronic device.Also, the beam feature 710 may be used to dissipate or redirect heataway from a heat-generating component (not shown) thermally coupled withthe beam feature 710. Further, as shown, the interior region 720 mayinclude a textured region 722 to facilitate the bonding process.

The methods, tools, and techniques shown in FIGS. 18-21 may to form asolid-state bond that directly secures the beam feature 710 with theenclosure 702, shown in FIG. 17. FIG. 18 illustrates an isometric viewof the enclosure 702 secured in a fixture 740 and undergoing a bondingprocess, in accordance with the described embodiments. As shown, thebonding process may include a bonding tool 750. In some embodiments, thebonding tool 750 is an ultrasonic welding tool. Further, in someembodiments, the bonding tool 750 is a torsional ultrasonic welding toolhaving an ultrasonic horn 752 capable of rotating about a centerline 756(shown as an imaginary line extending through the bonding tool 750) in afirst direction and a second direction opposite the first direction(that is, back and forth in a radial manner) along an arc-like, orpartially circular, path (denoted by the arrow 754) deliveringultrasonic energy to the beam feature 710. In some embodiments, theultrasonic horn 752 may be actuated with a frequency approximately inthe range of 10-40 kHz and rotates a distance approximately in the rangeof 7 to 15 micrometers. Accordingly, during an initial bondingoperation, the ultrasonic horn 752 may cause a back and forth motion tothe beam feature 710. At these frequencies and relatively smalldistances, the beam feature 710 is accurately welded at a desiredlocation on the enclosure 702. Also, the bonding tool 750 may include aninternal channel 758 that combines with an external channel 762 to forma vacuum channel to supply a vacuum that secures the beam feature 710with the bonding tool 750 and maintains the beam feature 710 in adesired location.

FIG. 19 illustrates a side view of a beam feature 710 undergoing abonding operation to secure the beam feature 710 with an enclosure 702,in accordance with the described embodiments. As shown, the bonding tool750 performs a bonding operation to a first region 712 of the beamfeature 710 using a torsional ultrasonic welding operation. The repeatedarc-like, or partially circular, movement by the bonding tool 750 causesthe first region 712 of the beam feature 710 to secure with theenclosure 702. Also, the bonding tool 750 may apply a force (denoted byan arrow 764) to the beam feature 710 in a direction toward theenclosure 702. During a bonding operation, the bonding tool 750 maycause metal oxides of both the beam feature 710 and the enclosure 702 tobreak down in a joint region generally defined by a bonding locationbetween the beam feature 710 and the enclosure 702. This causes adiffusion bond, and atoms of the beam feature 710 and the enclosure 702may intermingle and diffuse into one another. Also, the textured region722 of the interior region of the enclosure 702 along with a texturedregion of the bonding tool 750 direct ultrasonic energy to the jointregion where the beam feature 710 bonds with the enclosure 702.

FIG. 20 illustrates a side view of the beam feature 710 shown in FIG. 19with the bonding tool 750 performing a welding operation to a secondregion 714 of the beam feature 710. Although not shown, the bonding tool750 may perform several additional welding operations to the beamfeature 710. For example, the bonding tool 750 may perform weldingoperations to regions opposite the first region 712 and the secondregion 714. However, due in part to the rotational motional of atorsional ultrasonic welding tool, subsequent welds do not disturb priorwelds, preventing the beam feature 710 from detaching or breaking off ofthe enclosure 702 along the prior welds, and all welds of beam feature710 combine to maintain the beam feature 710 with the enclosure 702.

FIG. 21 illustrates an isometric view of an exterior region 770 of theenclosure shown in FIG. 21. For purposes of illustration, the texturedregion is not shown. Despite the torsional ultrasonic welding processpreviously described, the beam feature 710 is bonded to the interiorregion 720 without leaving any visible mark or trace on the exteriorregion 770. Also, in some embodiments, the thickness 772 of theenclosure is 3 millimeters or less. Further, in some embodiments, thethickness 772 is 1 millimeter or less. In either event, the exteriorregion 770 is free of any marks or traces. This allows for an electronicdevice that includes an enclosure 702 with several structuralenhancements while still providing an aesthetic finish.

FIG. 22 illustrates an isometric view of multiple beam features securedwith an enclosure 802 using a bonding operation. The bonding operationmay be a torsional ultrasonic welding process previously described. Asshown, a first beam feature 812 and a second beam feature 814, disposedin the enclosure 802, may serve multiple functions. For example, thefirst beam feature 812 and the second beam feature 814 can support acomponent, such as a display panel 106 (shown in FIG. 1) when theenclosure 802 is a display housing. Also, the first beam feature 812 andthe second beam feature 814 can be used to dissipate or transfer heataway from heat-generating components thermally coupled with one or bothof the beam features. Also, although not shown, any of the protrudingfeatures 510 (shown in FIG. 14) may be disposed throughout the enclosure802 and used in conjunction with the first beam feature 812 and/or thesecond beam feature 814.

As shown in FIGS. 18-20, the bonding tool 750 may be designed to perform“spot welds” in local regions of the beam feature 710. However, otherbonding tools may be designed to receive the entire beam feature. Forexample, FIG. 23 illustrates an isometric view of an alternateembodiment of a bonding tool 950. The bonding tool 950 may also be atorsional bonding tool having a cavity or opening designed tosubstantially receive a beam feature 910 and actuate the beam feature910 in a rotational motion in a manner previously described. Further,the bonding tool 950 may be designed to provide ultrasonic energy acrossan entire length of the beam feature 910, as opposed to a spot weldingoperation. This may allow welding of the beam feature 910 with theenclosure 902 in a single bonding operation. Also, although not shown,in some embodiments, the bonding tool 950 includes a linear bonding tooldesigned to provide ultrasonic energy to the beam feature 910 back andforth along a linear path, in accordance with the described embodiments.

A torsional ultrasonic welding tool can perform additional bondingoperations. For example, FIG. 24 illustrates a side view of anembodiment of an attachment feature 1110 undergoing a bonding operationto secure the attachment feature 1110 with an enclosure 1102, inaccordance with the described embodiments. The bonding tool 1150 may bea linear ultrasonic welding tool previously described. However, in theembodiment shown in FIG. 24, the bonding tool 1150 is a torsionalultrasonic welding tool. The attachment feature 1110 may be similar tothe third attachment feature 236 (shown in FIG. 8) and may extend acrossthe entire length of the enclosure 1102.

FIG. 25 illustrates the attachment feature 1110 shown in FIG. 24 afterthe bonding operation. As shown, the attachment feature 1110 may bebonded to the enclosure 1102 at a bonding location 1112 between theattachment feature 1110 and the enclosure 1102. The repeated arc-like,or partially circular, movement by the bonding tool 1150 causes theattachment feature 1110 to secure with the enclosure 1102. Inparticular, during the bonding operation, the bonding tool 1150 (shownin FIG. 24) causes metal oxides of both the attachment feature 1110 andthe enclosure 1102 to break down at the bonding location 1112. Thiscauses a diffusion bond, and metal atoms of the attachment feature 1110and the enclosure 1102 intermingle and diffuse into one another.

The previous embodiments describe techniques for securing a singlefeature with an enclosure. However, multiple features formed fromvarious materials may be simultaneously secured with an enclosure usinga single bonding step. For example, FIG. 26 illustrates an isometricview of a portion of an enclosure 1202 having a protruding feature 1210and an intermediate feature 1212 secured with an interior region 1220 ofthe enclosure 1202 using a bonding operation, in accordance with thedescribed embodiments. In some cases, the enclosure 1202, the protrudingfeature 1210, and the intermediate feature 1212 are formed from a metal,such as aluminum. However, the type of aluminum used in each feature maydiffer. For example, in some embodiments, the enclosure 1202 includes7000 series aluminum. Also, in some embodiments, the protruding feature1210 includes 6000 series aluminum. As such, the enclosure 1202 and theprotruding feature 1210 may be an aluminum alloy having a higherstrength than that of aluminum alone. Also, in some embodiments, theintermediate feature 1212 includes 1000 series generally associated witha pure aluminum that may have a hardness less than a hardness of theenclosure 1202 and a hardness of the protruding feature 1210.Accordingly, the intermediate feature 1212 may be softer than that ofthe enclosure 1202 and the protruding feature 1210. This allows for asingle bonding operation to co-bond the protruding feature 1210 and theintermediate feature 1212 with the enclosure 1202. It should be notedthat other metals may be used with similar relative hardness properties.That is, in some embodiments, the hardness of the intermediate feature1212 is less than that of the enclosure 1202 and the protruding feature1210, while a metal other than aluminum or aluminum alloy is used.

The intermediate feature 1212 (partially shown), which may extend alongvarious portions of the enclosure 1202, may be used as an electricalgrounding path for a component electrically coupled with the protrudingfeature 1210 and/or the intermediate feature 1212 when the intermediatefeature 1212 is electrically coupled with an electrical ground (notshown). Alternatively, or in conjunction, the intermediate feature 1212may be used as a heat dissipation path for a component thermally coupledwith the protruding feature 1210 and/or the intermediate feature 1212when the intermediate feature 1212 is thermally coupled with a heat sink(not shown). Also, the intermediate feature 1212 may be formed fromanother metal or metals having a strength or hardness less than that ofthe enclosure 1202 and the protruding feature 1210. For example, theintermediate feature 1212 may include copper.

FIGS. 27-29 illustrate a solid-state bonding process that may be used todirectly bond the protruding feature 1210 and the intermediate feature1212 with the enclosure 1202, as shown in FIG. 26. FIG. 27 illustrates aside view of the protruding feature 1210 and the intermediate feature1212 undergoing a bonding operation to secure the protruding feature1210 and the intermediate feature 1212 with the enclosure 1202. Asshown, a bonding tool 1250 engages the protruding feature 1210. In someembodiments, the bonding tool 1250 is a linear ultrasonic welding toolhaving an ultrasonic horn 1254 capable of actuating along an axisdefined by a linear path (denoted by a first arrow 1) and deliveringultrasonic energy to the protruding feature 1210 and the intermediatefeature 1212 in a manner previously described. For additional support, afixture 1206 may be used to affix the enclosure 1202 in a stationaryposition during the bonding operation. During the bonding operation, thebonding tool 1250 causes metal oxides of both the protruding feature1210, the intermediate feature 1212, and the enclosure 1202 to breakdown in joint regions generally defined by a bonding location between 1)the protruding feature 1210 and the intermediate feature 1212, and 2)the intermediate feature 1212 and the enclosure 1202. This causes adiffusion bond, and metal atoms of the protruding feature 1210, theintermediate feature 1212, and the enclosure 1202 intermingle anddiffuse into one another. Also, although not shown, a textured region(previously described) of the enclosure 1202 and the textured region ofthe bonding tool 1250 may be used facilitate the bonding operation bydirecting energy in the form of ultrasonic energy to the joint regions.Also, in addition to actuating along the path denoted by the first arrow1, the bonding tool 1250 may apply a force (denoted by a second arrow1256) to the intermediate feature 1212 in a direction toward theenclosure 1202.

FIG. 28 illustrates a side view of the protruding feature 1210 and theintermediate feature 1212 shown in FIG. 27, further undergoing thebonding operation. As shown, the bonding operation causes the relativelysoft material of the intermediate feature 1212 to shift in locations inwhich the protruding feature 1210 engages the intermediate feature 1212,due in part to the ultrasonic energy and the force applied to theintermediate feature 1212 by the bonding tool 1250.

FIG. 29 illustrates a side view of the protruding feature 1210 and theintermediate feature 1212 secured with the enclosure 1202 subsequent tothe bonding operation shown in FIG. 28. As shown, additional material ofthe intermediate feature 1212 may shift and build up around theprotruding feature 1210. Also, although not shown, the protrudingfeature 1210 may be a boss and may further include an internal threadedregion designed to receive a fastener to secure a component with theenclosure 1202 via the protruding feature 1210. Also, the co-bonding oftwo more features may also be performed in a manner such that anexterior region (not shown) of the enclosure 1202 does not include anymarks, traces, and/or burns associated with the bonding operation.

Other metallurgic bonding may be used to bond together two or morefeatures to a substrate. FIG. 30 illustrates an isometric view of beamfeatures 1310 secured with a portion of an enclosure 1302 using abonding operation, in accordance with the described embodiments. Theenclosure 1302 may be formed from the first type metal previouslydescribed. The beam features 1310 may be formed from the second typemetal previously described. However, in other embodiments, the beamfeatures 1310 include aluminum. The beam features 1310 may be used toprovide stiffness to the enclosure 1302, particularly when the enclosure1302 includes a thickness 1372 that is relatively small. A bonding tool(described below) may be designed to apply a relatively large amount offorce to each of the beam features 1310 while also applying a linearactuation to each of the beam features 1310. As a result of therelatively large force and the actuation, the beam features 1310 and theenclosure 1302 may soften, but not melt, in a joint region defined by abonding location between each one of the beam features 1310 and theenclosure 1302. As shown, in the enlarged view, a portion of the firstbeam feature 1312 may soften during the bonding operation cures aroundthe first beam feature 1312.

The beam features 1310 may include different sizes. For example, a firstbeam feature 1312 may include a thickness greater than a thickness of asecond beam feature 1314. Also, the beam features 1310 may include aportion or portions free of material. For example, a third beam feature1316 may include an underpass 1318. When one or more of beam features1310 include an underpass, the beam features 1310 may provide structuralsupport to the enclosure while also providing a channel (defined by theunderpasses) allowing one or more structures (such as a cable assembly)to extend through a beam feature having an underpass.

FIGS. 31-33 illustrate a solid-state bonding operation capable ofdirectly bonding several beam features, similar to the beam features1310 shown in FIG. 30. FIG. 31 illustrates a side view of a first beamfeature 1412 and a second beam feature 1414 undergoing a bondingoperation to secure the first beam feature 1412 and the second beamfeature 1414 with an enclosure 1402. As shown, a bonding tool 1450 isused to perform the bonding operation. A fixture 1406 may be used toaffix the enclosure 1402 in a stationary position during the bondingoperation. In some embodiments, the bonding tool 1450 is a welding tool.In the embodiment shown in FIG. 31, the bonding tool 1450 is a linearfriction welding tool. The bonding tool 1450 may be designed to apply alinear actuation (in a direction of a first arrow 1454) as well asprovide a force to the first beam feature 1412 and the second beamfeature 1414 (denoted by a second arrow 1456) in a direction toward theenclosure 1402. In some embodiments, the force may be at least 1 ton offorce. Also, in some embodiments, the bonding tool 1450 may cause alinear actuation of the first beam feature 1412 and the second beamfeature 1414 a distance approximately in the range of 0.8 mm to 2 mm. Insome cases, the linear actuation is about 1 mm. While the embodimentshown in FIG. 31 includes multiple beam features, in other embodiments,the bonding tool 1450 is designed to perform a linear friction weld to asingle beam feature. Still, in other embodiments, the bonding tool 1450is designed to perform a linear friction weld to three or more beamfeatures.

FIG. 32 illustrates a side view of the first beam feature 1412 and thesecond beam feature 1414 shown in FIG. 31, further undergoing thebonding operation. As shown, the enclosure 1402, the first beam feature1412, and the second beam feature 1414 begin to soften between a firstjoint region between the first beam feature 1412 and the enclosure 1402,as well as a second joint region between the second beam feature 1414and the enclosure 1402. FIG. 33 illustrates a side view of the firstbeam feature 1412 and the second beam feature 1414 shown in FIG. 32,further undergoing the bonding operation. The first beam feature 1412and the second beam feature 1414 may continue to soften at the firstjoint region and the second joint region, respectively. Also, theenclosure 1402 may undergo an additional softening. The linear frictionwelding process may continue (or repeat) until the first beam feature1412 and the second beam feature 1414 are secured with the enclosure1402 in a desired manner.

FIG. 34 illustrates beam features 1510 secured with an interior region1520 of an enclosure 1502 for an electronic device, in accordance withthe described embodiments. The beam features 1510 may be similar to, forexample, the beam features shown in FIGS. 30-33. Further, the beamfeatures 1510 may be bonded with the enclosure 1502 by a linear frictionwelding process previously described. In some embodiments, the enclosure1502 is a display housing. As shown, the enclosure 1502 may include afirst circuit board 1522, a second circuit board 1524, and a thirdcircuit board 1526. The first circuit board 1522 may be electricallycoupled with the third circuit board 1526 by a cable assembly 1528passing through several underpasses (similar to the underpass 1318 shownin FIG. 30) of the beam features 1510. Also, the first circuit board1522 may be thermally coupled with the first beam feature 1512 and thesecond beam feature 1514, and the second circuit board 1524 is thermallycoupled with the third beam feature 1516 and the fourth beam feature1518. As such, the first circuit board 1522 may dissipate heat throughthe first beam feature 1512 and the second beam feature 1514, and thesecond circuit board 1524 may dissipate heat the third beam feature 1516and the fourth beam feature 1518. This heat dissipation may allowintegrated circuits disposed on the first circuit board 1522 and thesecond circuit board 1524 to operate within their specified temperaturesand perform their desired operations without overheating. Also, althoughonly the interior region 1520 of the enclosure 1502 is shown, theexterior region (opposite the interior region 1520) may be free of anymarks, traces, and/or burns associated with the linear friction weldingoperation, even in instance when a thickness of the enclosure 1502 is afew millimeters or less.

The linear friction welding operation allows an enclosure to undergo asignificant material removal operation (based on the linear frictionwelding), and yet also regain a majority of its original strength andrigidity by the addition of structural features. Also, an entire surfaceof the beam feature (or features) contacts the enclosure during theoperation and accordingly, the weld is made across the entire surfacearea to form a stronger bond. Further, the manufacturing times for theenclosure may be significantly reduced. For example, rather thanperforming a selective subtractive machining operation that removesmaterial from the enclosure while allowing some portions (such asstructures structure similar to that of a beam feature) of the enclosureto remain, the entire enclosure may undergo a continuous materialremoval operation followed by a welding. The dual-step operation in thelatter scenario may require less overall time than that of the selectivesubtractive machining operation. This process not only reducesmanufacturing time but also uses fewer materials making it a moreenvironmentally friendly process. Further, the beam features may be madefrom the second type material (previously described) allowing for a morepredefined strength and/or cost approach based upon the material (ormaterials) selected for the beam features.

In some cases, during a linear friction welding operation, it may bedesirable to reduce a contact surface of the beam feature. A “contactsurface” may be referred to as a surface that engages another surfaceduring a welding operation, and is actuated with respect to anothersurface. A reduced contact surface may reduce a surface area associatedwith an interface region between two parts, and in turn, reduce the heatgenerated during a welding operation. This may also contribute to anexterior region opposite a region associated with the linear frictionwelding operation from having a mark, trace, and/or burn.

FIGS. 35 and 36 illustrate embodiments of a beam feature having ribfeature designed to reduce the contact surface of the rib feature duringa welding operation. Rather than entire side or surface of a beamfeature engaging a substrate, the beam features may represent a reducedcontact surface of the beam feature. FIG. 35 illustrates an isometricview of an embodiment of a beam feature 1610 including rib features 1620extending along a region of the beam feature 1610. As shown, a first ribfeature 1622, a second rib feature 1624, and a third rib feature 1626extend lengthwise across the beam feature 1610. Although three ribfeatures are shown, the number of rib features can vary. FIG. 36illustrates an isometric view of an alternate embodiment of a beamfeature 1660 including rib features 1670 extending along a region of thebeam feature 1660. As shown, a first rib feature 1672, a second ribfeature 1674, a third rib feature 1676, a fourth rib feature 1678, and afifth rib feature 1682 extend widthwise across the beam feature 1660.Although five rib features are shown, the number of rib features canvary. The rib features shown in FIGS. 35 and 36 may contact an enclosureduring a linear friction welding operation between the beam features andthe enclosure. Also, while an enclosure may be formed from the firsttype metal, the beam features shown in FIGS. 35 and 36 may be formedfrom the second type metal previously described.

FIGS. 37 and 38 illustrate a bonding operation for a beam feature havingrib features extending across the beam feature. FIG. 37 illustrates anisometric view of the beam feature 1610 shown in FIG. 35 undergoing abonding operation to secure the beam feature 1610 with an enclosure1602. A fixture 1606 may be used to affix the enclosure 1602 in astationary position during the bonding operation. As shown, a bondingtool 1650 applies a linear actuation back and forth (denoted by a firstarrow 1654) while also applying a force in a direction (denoted by asecond arrow 1656) in a direction toward the enclosure 1602. In someembodiments, the force applied by the bonding tool 1650 in the directionof the enclosure 1602 is at least 1 ton of force or more. Also, in someembodiments, the linear actuation may be approximately in the range of0.8 mm to 2 mm. FIG. 38 illustrates an isometric view of the beamfeature 1610 shown in FIG. 37, subsequent to the beam feature 1610 beingwith the enclosure 1602 by the bonding operation. As a result of thelinear friction welding operation, the rib features 1620 (shown in FIG.37) significantly soften, but do not melt, to define material 1630 formsaround the beam feature 1610. It should be understood that the materialpreviously defined the rib features 1620 in FIG. 37. Accordingly, aheight of the beam feature 1610 may be reduced based upon the breakdownor softening of the rib features.

Referring again to FIG. 37, the direction of linear actuation (denotedby the first arrow 1654) of the bonding tool 1650 is substantiallyparallel with respect to a sidewall 1604 of the enclosure 1602. Further,the rib features 1620 are also substantially parallel with respect tothe sidewall 1604. This allows the welding operation to be performed inclose proximity to the sidewall 1604 without disturbing the sidewall1604. As such, the linear friction welding operation allows forflexibility in placement of the beam feature 1610.

FIG. 39 illustrates a plan view of the beam feature 1660 shown in FIG.36 undergoing a solid-state bonding operation to directly secure thebeam feature 1660 with an enclosure 1652. A bonding tool 1690 having thesame linear actuation and downward force (toward the enclosure 1652) asthat of the bonding tool 1650 (shown in FIG. 37) may be used. As shown,the rib features 1670, such as the first rib feature 1672 (widthwise),and the linear actuation (denoted by the arrow 1694) of the bonding tool1690 are substantially parallel with respect to a sidewall 1658 of theenclosure 1652. FIG. 40 illustrates a plan view of the beam feature 1660shown in FIG. 39 with the beam feature 1660 secured with the enclosure1652 by the bonding operation. The rib features 1670 (shown in FIG. 39)soften during the bonding operation, but do not melt, and material 1680previously defining the rib features 1670 forms around the beam feature1660. The widthwise configuration allows the rib features 1670 (shown inFIG. 39) along with the linear actuation of the bonding tool 1690, bothof which are parallel with respect to the sidewall 1658, allow for thebeam feature 1660 to be in close proximity with respect to the sidewall1658. Also, although not shown, the beam features shown in FIGS. 37-40may include an underpass (similar to the underpass 1318 shown in FIG.30).

Also, although not shown, the beam features (with or without ribfeatures) previously described offer additional advantages, particularlywhen the available tools limit a desired configuration. For example, anenclosure including a sidewall may further include a beam feature,welded to the enclosure by welding operation and capable of combiningwith the sidewall at a right angle with respect to the sidewall. Inanother example, during a material removal process, a cutting tool, suchas a T-cutting tool, designed to make an undercut to form or define, forexample, a lip region may be too large based upon the size of the beamfeature or the sidewall. In other words, a cutting operation defined bythe T-cutting tool may remove more material than desired. However, awelding operation may be able to “add back” a feature and the structuralconfiguration is formed to a desired specification. For example, a beamfeature having a pre-cut or a pre-formed indention to define a lipregion, may be welded to the enclosure. In yet another example, two beamfeatures may be welded together to define a square corner, that is, thetwo beam features may define a right angle. This may be advantageousover a cutting operation that includes a circular cutting tool thatdefines a corner having a radius that includes a rounded, or non-square,corner, as the circular cutting tool may not be able to form a sharpright angle.

In some cases, a bonding operation may be used to drive a bonded featurebelow a bonding surface of an enclosure. For example, FIG. 41illustrates an isometric view of an embodiment of a protruding feature1710 undergoing a solid-state bonding operation by a bonding tool 1750to directly bond the protruding feature 1710 with an enclosure 1702, inaccordance with the described embodiments. It will be appreciated aportion of the enclosure 1702 is represented, and the enclosure 1702 maytake on any structural component previously described for an enclosure.Also, the enclosure 1702 may include the first type material (previouslydescribed), and the protruding feature 1710 may include the second typematerial (previously described). In some embodiments, the bonding tool1750 is a rotary tool designed for a high speed rotational movement andmay be capable of performing a rotational inertial friction weldingoperation. For example, the bonding tool 1750 may include a rotary speedof 100,000 revolutions per minute (RPMs) or higher. As shown, thebonding tool 1750 is capable of rotating the protruding feature 1710 ina generally circular motion (shown by the arrow 1754) about alongitudinal axis defined by a centerline 1756 extending through theprotruding feature 1710. Also, in some embodiments, the protrudingfeature 1710 includes a diameter 1712 of 6 mm or less. Further, in someembodiments, the protruding feature 1710 includes a diameter 1712 of 2mm or less. The relatively small surface area of the protruding feature1710, based upon the diameter 1712, provides a relatively small bondingsurface (or contact surface) during the bonding operation. However, dueto the high speeds of the bonding tool 1750, sufficient heat may begenerated to form a bond between the enclosure 1702 and the protrudingfeature 1710.

FIG. 42 illustrates a side view of the bonding tool 1750 rotating theprotruding feature 1710 to form a bond between the protruding feature1710 and the enclosure 1702. Similar to previous bonding operations, thebonding operation shown in FIG. 42 may cause the metal oxides of theprotruding feature 1710 and the enclosure 1702 to break down to form adiffusion bond between the atoms of the protruding feature 1710 and theenclosure 1702, as both enclosure 1702 and the protruding feature 1710begin to soften, but not melt, at a joint region defined by a regionbetween and around the enclosure 1702 and the protruding feature 1710.However, in this bonding operation, the bonding tool 1750 is designed toprovide a force to the protruding feature 1710 to “sink” or cause aportion of the protruding feature 1710 to be disposed below a surface ofthe enclosure 1702. For example, FIG. 43 illustrates a side view showingthe protruding feature 1710 partially embedded in the enclosure 1702 dueto the bonding operation. The bonding tool 1750 may include additionalfeatures to assist the bonding operation. For example, the bonding tool1750 may be precisely timed to stop the bonding operation when theenclosure 1702 and the protruding feature 1710 solidify. Further,despite the diameter 1712 of the protruding feature 1710 beingrelatively small, the bonding tool 1750 is designed to provide aninertial force that does not break the protruding feature 1710. This isdue in part to a spindle within the bonding tool 1750 disengaging at amoment when, for example, the bonding operation is complete.

FIG. 44 illustrates a side view of the protruding feature 1710 bondedwith the enclosure 1702. As shown, a portion of the protruding feature1710 is disposed below a surface 1704 of the enclosure 1702. Additionalprocesses may be performed to the protruding feature 1710. For example,the protruding feature 1710 may undergo a material removal operation(not shown) to define an internal cavity. Further, in some embodiments,the internal cavity, when formed, includes a threaded internal cavitydesigned to receive a threaded fastener.

The embodiments described herein illustrates various features. In someembodiments, an electronic device may include several features combinedinto the electronic device. For example, in some embodiments, theelectronic device includes at least an attachment feature (such as thefirst attachment feature 232 shown in FIG. 2), a protruding feature(such as the first protruding feature 512 shown in FIG. 10), a beamfeature (such as the beam feature 710 shown in FIG. 17). Further, anembodiment of an electronic device may include two or more of each ofthe aforementioned features.

FIG. 45 illustrates a flowchart 1800 showing a method for forming anelectronic device having an enclosure that includes a first part and asecond part rotatably coupled with the first part, in accordance withthe described embodiments. The first part and the second may be part ofan enclosure for the electronic device. For example, the first part mayinclude a display housing, and the second part may include a baseportion. Accordingly, in some embodiments, the second part may include amagnet.

In step 1802, an attachment feature is engaged with a bonding toolconfigured to bond the attachment feature with the first part. Thebonding tool may include an ultrasonic bonding tool designed to transmitultrasonic energy to the attachment feature when engaged with theattachment feature. In this regard, the bonding tool may vibrate or moveat ultrasonic frequencies of 10 kHz or more.

In step 1804, the attachment feature is actuated via the bonding tool.The actuation may be due in part to the ultrasonic energy generated fromthe bonding tool. The actuation by the bonding tool may pass through theattachment feature. This may cause a solder material disposed betweenthe attachment feature and the first part to melt and bond theattachment feature with the first part. In some embodiments, in a closedconfiguration between the first part and the second part, the attachmentfeature magnetically couples with the magnet to define a magneticcircuit, and the first part is separated from the second part by a gapthat is based upon the magnetic circuit.

FIG. 46 illustrates a flowchart 1900 showing a method for forming anelectronic device having an enclosure that includes a first part and asecond part rotatably coupled with the first part, in accordance withthe described embodiments. The first part may be formed of a first typematerial and the second part formed from a second type materialdissimilar to the first type material. As an example, the first typematerial may include aluminum or an aluminum alloy, and the second typematerial may include titanium, molybdenum, stainless steel, brass,bronze, or the like. Also, the first part may include an enclosure ofthe electronic device. Also, the second part may include, for example,an attachment feature, a protruding feature, or a beam feature, inaccordance with the described embodiments.

In step 1902, a force is applied by a bonding tool to the first partwhen the first part is in contact with the second part at the jointregion. The bonding tool may include an ultrasonic bonding tool.Further, the bonding tool may be capable of bonding operations such aslinear ultrasonic welding, torsional ultrasonic welding, and/or linearfrictional welding.

In step 1904, the first part is actuated by the bonding tool in arepeated manner with respect to the second part in a first direction andsubsequently in a second direction opposite the first direction suchthat at least some of the first type material intermingles with at leastsome of the second type material within the joint region while applyingthe force. The first and second directs may include a “back and forth”motion along a linear path, or along a partially circular path.

The various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination.Various aspects of the described embodiments can be implemented bysoftware, hardware or a combination of hardware and software. Thedescribed embodiments can also be embodied as computer readable code ona computer readable medium for controlling manufacturing operations oras computer readable code on a computer readable medium for controllinga manufacturing line. The computer readable medium is any data storagedevice that can store data which can thereafter be read by a computersystem. Examples of the computer readable medium include read-onlymemory, random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, andoptical data storage devices. The computer readable medium can also bedistributed over network-coupled computer systems so that the computerreadable code is stored and executed in a distributed fashion.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device, comprising: a base portion;a magnet bonded to the base portion by a solder material; a housingrotatably coupled with the base portion and formed from a first type ofmetal; and an attachment feature formed from a second type of metaldifferent from the first type of metal and secured to the housing via adiffusion bond, wherein in a closed configuration between the baseportion and the housing, the second type of metal causes the attachmentfeature to magnetically couple with the magnet to define a magneticcircuit.
 2. The electronic device of claim 1, wherein: the electronicdevice further comprises a protruding feature bonded with the housing;and the protruding feature comprises an internal threaded region tosecure a component with the housing.
 3. The electronic device of claim2, further comprising an intermediate feature, wherein the intermediatefeature is directly bonded with the protruding feature and the housing.4. The electronic device of claim 1, wherein: the electronic devicefurther comprises a beam feature bonded directly with the housing; andthe beam feature extends along an interior region of the housing toprovide structural support to the housing.
 5. The electronic device ofclaim 4, wherein the electronic device further comprises a cableassembly, and wherein the cable assembly extends through an underpass ofthe beam feature.
 6. The electronic device of claim 4, wherein the beamfeature is bonded to a top wall of the housing via a diffusion bond. 7.The electronic device of claim 6, wherein a thickness of the housing is1 mm or less at the diffusion bond.
 8. The electronic device of claim 1,wherein the electronic device is a laptop computer.
 9. The electronicdevice of claim 1, wherein the base portion comprises aluminum or analuminum alloy.
 10. The electronic device of claim 9, wherein the magnetis at least partially disposed in a channel formed in a sidewall of thebase portion.
 11. The electronic device of claim 2, wherein theprotruding feature is bonded to a top wall of the housing via adiffusion bond.
 12. The electronic device of claim 11, wherein athickness of the housing is 1 mm or less at the diffusion bond.